DigiGuard® Gloss 115
Brand Family Overview
Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.See more Mold Release products.
Provides good resistance to heat and a low coefficient of friction as an overprint varnish. It has good adhesion to most packaging films and inks and can help protect the print from damage. It can be used in demanding applications where ease of slip over hot surfaces is required - for example in vertical form, fill and seal packaging.
Overprint varnish for flexible packaging
This product is used in many applications including the following:
|Overprint Varnish||Applicator - flexo / gravure/ roll, controlled slip, heat resistance, high gloss|
See more products recommended for Overprint Varnish.
These physical properties are typical but should not be considered specifications.
|Percent Non-Volatile||37.0 - 40.0|
|Brookfield Viscosity (cps, mPa·s)||<300|
Site of Manufacture (and Product Code)
DigiGuard® Gloss 115 can be applied by flexo, gravure or roll coater. A drying temperature of 60C or over will ensure the optimum heat resistance of the coating is achieved.
Ensure adequate ventilation. Handle in accordance with good industrial hygiene and safety practice. Use personal protective equipment as required.