DigiGuard® Gloss 115

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

See more Mold Release products.

Usage

Provides good resistance to heat and a low coefficient of friction as an overprint varnish. It has good adhesion to most packaging films and inks and can help protect the print from damage. It can be used in demanding applications where ease of slip over hot surfaces is required - for example in vertical form, fill and seal packaging.

Description

Overprint varnish for flexible packaging

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Overprint VarnishApplicator - flexo / gravure/ roll, controlled slip, heat resistance, high gloss

See more products recommended for Overprint Varnish.
Physical Properties

These physical properties are typical but should not be considered specifications.

Appearancewhite,translucent liquid
Percent Non-Volatile37.0 - 40.0
Brookfield Viscosity (cps, mPa·s) <300
Spindle Number2
RPM60

Site of Manufacture (and Product Code)

CIN (DGG115)

Application Data

DigiGuard® Gloss 115 can be applied by flexo, gravure or roll coater. A drying temperature of 60C or over will ensure the optimum heat resistance of the coating is achieved.

Storage

Ensure adequate ventilation. Use personal protective equipment as required.