DigiPrime® 4450

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

See more Mold Release products.


A ready to use primer which provides excellent adhesion of HP Indigo ElectroInks® to most films and papers. It has exceptional anti-block properties and can be used for two sided printing. It also has food contact approval.


Print receptive primer for HP Indigo ElectroInks®.

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
HP Indigo SolutionsApplicator - flexo / gravure/ roll, OEM - Indigo various presses, Substrate - film, Substrate - paper

See more products recommended for HP Indigo Solutions.
Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceWhite, translucent liquid
Percent Non-Volatile30.0 - 32.0
Brookfield Viscosity (cps, mPa·s) <100
Spindle Number1

Site of Manufacture (and Product Code)

CIN (DP4450)
AUB (DP4450.E)
SNG (DP4450.S)

Application Data

DigiPrime® 4450 may be applied by flexo or gravure coating systems. Recommended application rate for films is between 0.5 to 0.2 gsm dry coat weight. For paper, slightly higher weights will be needed to overcome the absorption of the substrate, this will vary from paper to paper but dry weights around 0.7 to 1 gsm are recommended. EZ Cup Viscosity - #2 Cup, 22 - 24 sec.


Ensure adequate ventilation. Handle in accordance with good industrial hygiene and safety practice.