DigiPrime® 4453
Brand Family Overview
Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.
See more Mold Release products.Usage
A water resistant primer for both HP Indigo Electroinks® and Xeikon Electrophotographic toners and provides excellent adhesion to most papers and films. It is suitable for food contact and is especially useful for flexible packaging applications, as well as label production.
Description
Water based primer for Digital printing
Performance Attributes
This product is used in many applications including the following:
| Application | Properties Imparted |
|---|---|
| Other OEM Solutions | Applicator - flexo / gravure/ roll, Substrate - film, Substrate - paper |
See more products recommended for Other OEM Solutions.
Physical Properties
These physical properties are typical but should not be considered specifications.
| Appearance | White translucent liquid |
|---|---|
| Percent Non-Volatile | 28.0 - 30.0 |
| Brookfield Viscosity (cps, mPa·s) | <100 |
| Spindle Number | 1 |
| RPM | 60 |
Site of Manufacture (and Product Code)
CIN (DP4453)
AUB (DP4453.E)
SNG (DP4453.S)
Application Data
DigiPrime® 4453 may be applied via flexo, gravure or smooth roll coater. Dry thoroughly with hot, circulating air. May be used for in-line or off-line processes. Recommended application weight for film substrates is between 0.1-1.0 dry/m2. EZ #2 cup 19-21 s.