Brand Family Overview
Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.See more Mold Release products.
This APE free additive is used as a lubricant for fiber sizing applications.
Nonionic, paraffin wax emulsion
This product is used in many applications including the following:
|Cable & Cordage||lubricity/slip resistance, water resistance|
|Fiber Sizing||slip and lubricity, thermosets compatible|
See more products recommended for Cable & Cordage.
See more products recommended for Fiber Sizing.
These physical properties are typical but should not be considered specifications.
|Percent Non-Volatile||31.5 - 32.5|
|Brookfield Viscosity (cps, mPa·s)||<60|
Site of Manufacture (and Product Code)