Brand Family Overview
Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.See more Mold Release products.
Designed for use as a fiber sizing coating, this product offers excellent adhesion, a high Tg and is APE free.
Nonionic phenoxy dispersion
This product is used in many applications including the following:
|Fiber Sizing||chopped strands, PA compatible, PC compatible, PET/PBT compatible, PPS compatible, thermal stability, thermosets compatible|
See more products recommended for Fiber Sizing.
These physical properties are typical but should not be considered specifications.
|Percent Non-Volatile||30.0 - 33.0|
|Brookfield Viscosity (cps, mPa·s)||<4000|
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