Michem® Flex HS 268

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

See more Mold Release products.

Usage

Used for heat sealing or dry bond lamination applications, offering low temperature seal initiation and stronger bonds to paper, metal (foil or metalized surface), various primed films such as matt, pearlized cavitated BOPP or BOPET films. It should be used with the addition of a wax emulsion to control the coefficient of friction (typically 2 to 4% by weight) e.g. Michem® Lube 160 RPH.

Description

Water based dispersion of high molecular weight polyolefin

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Heat Seal Coatingsmetal, Substrate - film, Substrate - paper

See more products recommended for Heat Seal Coatings.
Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceWhite liquid
Percent Non-Volatile36.0 - 39.0
Brookfield Viscosity (cps, mPa·s) 100 - 350
Spindle Number3
RPM50

Site of Manufacture (and Product Code)

CIN (MFHS268)
SNG (MFHS268.S)

Application Data

Michem® Flex HS 268 can be applied via rod, gravure, and spray. The EZ cup viscosity value for a #3 cup is 33 - 35 seconds.

Storage

Ensure adequate ventilation. Handle in accordance with good industrial hygiene and safety practice.