Michem® Prime 2960

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

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Usage

Provides outstanding adhesion to both metallic and cellulosic substrates, and enhances the corrosion, water, grease, oil and solvent resistance of coatings and adhesives.

Description

Ethylene acrylic acid dispersion

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Cable & Cordageadhesion promotion, heat seal, water resistance
Textiles & Leatheradhesion promotion, heat seal, water resistance
Fiber SizingPE compatible
Nonwovensheat seal for binders

See more products recommended for Cable & Cordage.
See more products recommended for Textiles & Leather.
See more products recommended for Fiber Sizing.
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Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceSemi-translucent liquid
Percent Non-Volatile16.5 - 17.5
Brookfield Viscosity (cps, mPa·s) <500
Spindle Number2
RPM60

Site of Manufacture (and Product Code)

CIN (MP2960)
AUB (MP2960.E)
SNG (MP2960.S)

Storage

Handle in accordance with good industrial hygiene and safety practice.