Michem® Prime 4990R
Brand Family Overview
Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.
See more Mold Release products.Usage
Provides outstanding adhesion to both metallic and cellulosic substrates, and enhances the water, grease, oil and solvent resistance of coatings and adhesives. Can serve as a tie coat or primer for extrusion coatings, a foil laminate, a specialty paper coating, a paper sizing agent, a heat sealable coating, nonwoven binder and can also be used as a thermally active binder in thermal transfer release coatings.
Description
Ethylene acrylic acid dispersion
Performance Attributes
This product is used in many applications including the following:
| Application | Properties Imparted |
|---|---|
| Cable & Cordage | adhesion promotion, heat seal, water resistance |
| Heat Seal Coatings | metal, Substrate - paper |
| Inks | adhesion promotion, chemical resistance |
| Overprint Varnishes | adhesion promotion, chemical resistance |
| Thermal Transfer | release |
See more products recommended for Cable & Cordage.
See more products recommended for Heat Seal Coatings.
See more products recommended for Inks.
See more products recommended for Overprint Varnishes.
See more products recommended for Thermal Transfer.
Physical Properties
These physical properties are typical but should not be considered specifications.
| Appearance | White liquid |
|---|---|
| Percent Non-Volatile | 32.0 - 35.0 |
| Brookfield Viscosity (cps, mPa·s) | 200 - 850 |
| Spindle Number | 3 |
| RPM | 60 |
Site of Manufacture (and Product Code)
CIN (MP4990R)
AUB (MP4990R.E)
SNG (MP4990R.S)