Michem® Prime 4990R

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

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Provides outstanding adhesion to both metallic and cellulosic substrates, and enhances the water, grease, oil and solvent resistance of coatings and adhesives. Can serve as a tie coat or primer for extrusion coatings, a foil laminate, a specialty paper coating, a paper sizing agent, a heat sealable coating, nonwoven binder and can also be used as a thermally active binder in thermal transfer release coatings.


Ethylene acrylic acid dispersion

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Cable & Cordageadhesion promotion, heat seal, water resistance
Functional Coatingsthermal transfer release
Inksadhesion promotion, chemical resistance
Overprint Varnishesadhesion promotion, chemical resistance
Thermal Transferrelease

See more products recommended for Cable & Cordage.
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Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceWhite liquid
Percent Non-Volatile32.0 - 35.0
Brookfield Viscosity (cps, mPa·s) 200 - 850
Spindle Number3

Site of Manufacture (and Product Code)

CIN (MP4990R)
AUB (MP4990R.E)
SNG (MP4990R.S)


Handle in accordance with good industrial hygiene and safety practice.