Michem® Prime 5931

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

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Provides improved adhesion to polyolefin substrates and also exhibits excellent adhesion to paper, metallic and polymeric substrates as well as glass and polyester scrim. It can serve as a tie coat or primer and increases printability on metallic and polymeric substrates. It can be used as a heat sealable coating on most polymeric films, paper and foil. Patents Pending.


Modified ethylene acrylic acid dispersion

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Cable & Cordageadhesion promotion, heat seal
Textiles & Leatheradhesion promotion, heat seal
Fiber SizingPE compatible
Inksadhesion promotion, chemical resistance
Overprint Varnishesadhesion promotion, chemical resistance
Nonwovensheat seal for binders

See more products recommended for Cable & Cordage.
See more products recommended for Textiles & Leather.
See more products recommended for Fiber Sizing.
See more products recommended for Inks.
See more products recommended for Overprint Varnishes.
See more products recommended for Nonwovens.
Site of Manufacture (and Product Code)

CIN (MP5931)
AUB (MP5931.E)
SNG (MP5931.S)

Application Data

Michem®Prime 5931 can be applied by flexographic or rotogravure coating methods. A typical application rate of 1-2 gsm dry coating weight is recommended for most heat seal applications. As a tie coat or print primer application rates of 0.2 to 0.5gsm are usually sufficient. EZ Cup Viscosity = 8 - 13seconds, #3 Cup.