Mold Release 225SS

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

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Usage

Solvent based mold release agent suitable for use with ceramics.

Description

Solvent based, synthethic wax emulsion

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Die Lubes & Mold Releasesmold release

See more products recommended for Die Lubes & Mold Releases.
Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceWhite, slightly grainy liquid
Percent Non-Volatile1.5 - 2.5
Brookfield Viscosity (cps, mPa┬Ěs) <25
Spindle Number1
RPM60

Site of Manufacture (and Product Code)

CIN (MR225SS)

Storage

Handle in accordance with good industrial hygiene and safety practice.