NurtureYield® K 6010

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

See more Mold Release products.

Usage

Aids in anti-caking in water sensitive fertilizers.

Description

Nonionic synthetic wax dispersion

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Fertilizeranti-caking

See more products recommended for Fertilizer.
Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceWhite liquid
Percent Non-Volatile49.5 - 50.5
Brookfield Viscosity (cps, mPa·s) <500
Spindle Number2
RPM60

Site of Manufacture (and Product Code)

CIN (NYK6010)