NurtureYield® S 2001

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

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A natural based additive used to improve flow and plantability in film coatings and seed treatment formulations for field and other crops. It also reduces abrasion and helps to lessen dust-off. The recommended loading level is up to 4 fl. oz./100 lb. for both corn and soybeans.


Anionic natural wax emulsion

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Seed Coatingsbinder, block resistance, lubricity

See more products recommended for Seed Coatings.
Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceCream colored, opaque liquid
Percent Non-Volatile24.5 - 25.5
Brookfield Viscosity (cps, mPa·s) <15
Spindle Number1

Site of Manufacture (and Product Code)

CIN (NYS2001)
AUB (NYS2001.E)


Avoid contact with eyes. Ensure adequate ventilation. Handle in accordance with good industrial hygiene and safety practice. Wear personal protective equipment.