NurtureYield® S 2001
Brand Family Overview
Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.See more Mold Release products.
A natural based additive used to improve flow and plantability in film coatings and seed treatment formulations for field and other crops. It also reduces abrasion and helps to lessen dust-off. The recommended loading level is up to 4 fl. oz./100 lb. for both corn and soybeans.
Anionic natural wax emulsion
This product is used in many applications including the following:
|Seed Coatings||binder, block resistance, lubricity|
See more products recommended for Seed Coatings.
These physical properties are typical but should not be considered specifications.
|Appearance||Cream colored, opaque liquid|
|Percent Non-Volatile||24.5 - 25.5|
|Brookfield Viscosity (cps, mPa·s)||<15|
Site of Manufacture (and Product Code)
Avoid contact with eyes. Ensure adequate ventilation. Handle in accordance with good industrial hygiene and safety practice. Use personal protective equipment as required.