Sapphire 5.0

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

See more Mold Release products.

Usage

Designed as a primer for HP Indigo substrates to render them compatible to ink. It can be used on paper substrates.

Description

Primer for use with HP Indigo press.

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
HP Indigo SolutionsApplicator - flexo / gravure/ roll, OEM - Indigo ws10000, OEM - Indigo ws5000, OEM - Indigo ws7000, Substrate - paper

See more products recommended for HP Indigo Solutions.
Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceTranslucent liquid
Percent Non-Volatile4.8 - 5.3

Site of Manufacture (and Product Code)

AUB (Q4310A.E)
SNG (Q4310A.S)

Application Data

Q4310A (Sapphire 5.0) can be applied via flexo or direct gravure systems. The recommended dry coat weight is 30 to 60 mg/m². Use our Sapphire Indicator Solution to check quality of the coating. The anilox should be kept turning at all times to avoid premature drying of the solution. Cleaning with warm water, IPA or slightly acidic water is recommended. ISO Cup Viscosity - #3 Cup 25-31 sec. Do not dilute.

Storage

Ensure adequate ventilation. Handle in accordance with good industrial hygiene and safety practice. Use personal protective equipment as required.