StaticBan® 1005N

Brand Family Overview

Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.

See more Mold Release products.


A hot melt and cold set gluable conductive coating which imparts a reliable, electrically conductive surface around sensitive electronic parts such as integrated circuit chips, circuit boards and other similar items. Because of its exceptional heat resistance an overprint is not necessary.


Heat resistant conductive coating

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Food Serviceconductivity

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Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceBlack, semi-thin liquid
Percent Non-Volatile28.0 - 29.5
Brookfield Viscosity (cps, mPa·s) 150 - 500
Spindle Number2

Site of Manufacture (and Product Code)

CIN (STB1005N)

Application Data

StaticBan® 1005N can be applied by rod coater on or off-line at the corrugator.


Handle in accordance with good industrial hygiene and safety practice.