Mold Release 225SS

Brand Family Overview

NurtureYield® is a family of additives and binders for coatings formulations designed to protect and improve the performance and processing of agricultural materials. Products which can be improved by the use of NurtureYield include seeds, plants, and fruits.

See more NurtureYield products.

Usage

Solvent based mold release agent suitable for use with ceramics.

Description

Solvent based, synthethic wax emulsion

Performance Attributes

This product is used in many applications including the following:

ApplicationProperties Imparted
Die Lubes & Mold Releasesmold release

See more products recommended for Die Lubes & Mold Releases.
Physical Properties

These physical properties are typical but should not be considered specifications.

AppearanceWhite, slightly grainy liquid
Percent Non-Volatile1.5 - 2.5
Brookfield Viscosity (cps, mPa·s) <25
Spindle Number1
RPM60

Site of Manufacture (and Product Code)

CIN (MR225SS)

Storage

Handle in accordance with good industrial hygiene and safety practice.