Brand Family Overview
Mold Release is a solventborne polyethylene emulsion that eliminates the high stress between a mold and the molded part, typically used for ceramics. It allows for movement and shrinkage of the part during processing and subsequent temperature fluctuations. With Mold Release, the part releases clean.See more Mold Release products.
Provides slip and lubricity when used in fibersizing formulations. This product is APE free.
Nonionic microcrystalline wax emulsion
This product is used in many applications including the following:
|Cable & Cordage||lubricity/slip resistance|
|Fiber Sizing||slip and lubricity|
See more products recommended for Cable & Cordage.
See more products recommended for Fiber Sizing.
These physical properties are typical but should not be considered specifications.
|Appearance||Off-white, opaque liquid|
|Percent Non-Volatile||39.5 - 40.5|
|Brookfield Viscosity (cps, mPa·s)||<200|
Site of Manufacture (and Product Code)